Triple Play Communications

Technology

The TPC team’s development experience includes optical interface modules operating at data rates up to 40 Gb/s as well as a variety of RF designs. Prior developments include:

2.5 Gb/s Optical Interface Module Developments

• DWDM and TDM 160-pin Transponders

– Up to 180 km reach

• Small Form Factor Pluggable (SFP) Transceivers

– Up to 120 km reach

– Implemented automatic extinction ratio and power control

– Fully microprocessor controlled with user access to real time status of key optical parameters

– Customized features for unique customer requirements

– Successfully transitioned OC-3, OC-12, OC-48, and DWDM SFP high volume production line to Fabrinet (Thailand CM)

– Over 30K Telecom SFP modules produced, reaches from 2km to 120km using uncooled optics

• DWDM SFP Transceivers

– Up to 180km reach

– Very low DC power (<1W) operation including TEC circuitry for cooled optics

10 Gb/s Optical Interface Module Developments

• 300-pin DWDM and TDM Transponders

– Up to 80 km reach

– Successfully transitioned high volume production line to Asian CM

– Implemented key design features including low DC power TEC, full software control, single temperature testing, Rx and Tx Trace functions

– Created various customer specific configurations

• Full C/L Band Tunable DWDM 300-pin Transponder

– 80 km reach

– Improved OSNR tolerance

– Extended reach (>160km) designs available using duobinary modulation

• XFP TDM and DWDM Transceivers

40 Gb/s Optical Interface Module Developments

• 300-pin MSA Transponder

– Led 40Gb/s MSA committee and demonstrated MSA compliant transponder in March 2002

RF and High Speed Hardware Developments

• Driver, receiver, and mux/demux IC evaluation cards

• Microwave / MMW RF IC design

• 2.5G and 10G filtered jitter measurement subsystems

• FDM/FM data links at microwave frequencies

• FDM multiplexer/demultiplexers

• Frequency synthesized microwave receivers

• MZM biasing using spread spectrum techniques

• Temperature compensated driver and receiver circuits

• High DC efficiency Thermoelectric Cooler control

• High dynamic range receivers

• Wireless RF power amplifiers and low noise receivers

• Ruggedized digital and analog optical data links

• Wireless, compressed video/audio communications

• Test and evaluation boards